Design and modeling for 3D ICs and interposers / Madhavan Swaminathan, Ki Jin Han.

By: Contributor(s): Material type: TextTextSeries: WSPC series in advanced integration and packaging ; v. 2.Publisher: Singapore ; Hackensack, New Jersey : World Scientific Publishing Company, [2014]Copyright date: ©2014Description: 1 online resource (379 pages) : illustrationsContent type:
  • text
Media type:
  • computer
Carrier type:
  • online resource
ISBN:
  • 9789814508605 (ebook)
Subject(s): Genre/Form: LOC classification:
  • TA168 .S93 2014eb
Online resources:
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Includes bibliographical references and index.

Description based on online resource; title from PDF (ebrary, viewed December 30, 2013).

Electronic reproduction. Palo Alto, Calif. : ebrary, 2014. Available via World Wide Web. Access may be limited to ebrary affiliated libraries.

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