Materials for high-density electronic packaging and interconnection

Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council. [electronic resource] : - Washington, D.C. : Alexandria, VA : National Academy Press ; Available from Defense Technical Information Center, Cameron Station, 1990. - xiv, 139 p. : ill.

"NMAB-449."

Includes bibliographical references.


Electronic reproduction.
Palo Alto, Calif. :
ebrary,
2009.
Available via World Wide Web.
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Electronic packaging--Materials.
Electrical engineering--Materials.


Electronic books.

TK7870.15 / .N38 1990eb

621.381/046