Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging
Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [electronic resource] /
guest editors Christopher Bailey and Johan Liu.
- Bradford, England : Emerald Group Publishing, c2006.
- 72 p.
- Soldering & surface mount technology ; v.18, no. 2 .
Electronic reproduction.
Palo Alto, Calif. :
ebrary,
2009.
Available via World Wide Web.
Access may be limited to ebrary affiliated libraries.
Manufacturing processes.
Electronic packaging.
Electronic books.
TK7870.15 / .A48 2006eb
Electronic reproduction.
Palo Alto, Calif. :
ebrary,
2009.
Available via World Wide Web.
Access may be limited to ebrary affiliated libraries.
Manufacturing processes.
Electronic packaging.
Electronic books.
TK7870.15 / .A48 2006eb