Hermeticity testing of MEMS and microelectronic packages / (Record no. 183651)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 05969nam a2200457 i 4500 |
| 001 - CONTROL NUMBER | |
| control field | 0000194518 |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20171002070110.0 |
| 006 - FIXED-LENGTH DATA ELEMENTS--ADDITIONAL MATERIAL CHARACTERISTICS | |
| fixed length control field | m o d |
| 007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION | |
| fixed length control field | cr cn||||||||| |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 140515t20132013maua ob 001 0 eng|d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| Canceled/invalid ISBN | 9781608075270 (cloth) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| Canceled/invalid ISBN | 1608075273 (cloth) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 9781608075287 (e-book) |
| 035 ## - SYSTEM CONTROL NUMBER | |
| System control number | (CaPaEBR)ebr11069355 |
| 040 ## - CATALOGING SOURCE | |
| Original cataloging agency | CaPaEBR |
| Language of cataloging | eng |
| Description conventions | rda |
| -- | pn |
| Transcribing agency | CaPaEBR |
| 050 14 - LIBRARY OF CONGRESS CALL NUMBER | |
| Classification number | TK7875 |
| Item number | .C67 2013eb |
| 082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER | |
| Classification number | 621.381 |
| Edition number | 23 |
| 100 1# - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Costello, Suzanne, |
| Relator term | author. |
| 245 10 - TITLE STATEMENT | |
| Title | Hermeticity testing of MEMS and microelectronic packages / |
| Statement of responsibility, etc. | Suzanne Costello, Marc P.Y. Desmulliez. |
| 264 #1 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE | |
| Place of production, publication, distribution, manufacture | Boston : |
| Name of producer, publisher, distributor, manufacturer | Artech House, |
| Date of production, publication, distribution, manufacture, or copyright notice | [2013] |
| 264 #4 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE | |
| Date of production, publication, distribution, manufacture, or copyright notice | ©2013 |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | 1 online resource (197 pages) : |
| Other physical details | illustrations. |
| 336 ## - CONTENT TYPE | |
| Content type term | text |
| Source | rdacontent |
| 337 ## - MEDIA TYPE | |
| Media type term | computer |
| Source | rdamedia |
| 338 ## - CARRIER TYPE | |
| Carrier type term | online resource |
| Source | rdacarrier |
| 490 1# - SERIES STATEMENT | |
| Series statement | Integrated microsystems series |
| 504 ## - BIBLIOGRAPHY, ETC. NOTE | |
| Bibliography, etc. note | Includes bibliographical references and index. |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Formatted contents note | Machine generated contents note: References -- pt. 1 Introduction to Hermetic Packages and Leak Types -- 1.The Evolution of Packages, Their Sealing Methods, and Modes of Fabrication -- 1.1.Introduction -- 1.2.The Evolution of Microelectronics and MEMS Packages -- 1.3.MEMS Sealing Techniques and Mode Package Fabrication -- 1.3.1.Materials -- 1.3.2.Sealing Techniques -- 1.4.Summary of MEMS Packaging Materials and Techniques -- References -- 2.Assembly, Packaging, and Environmentally Induced Failures in MEMS -- 2.1.Introduction -- 2.2.Particle Contamination -- 2.3.Thermomechanical Constraints -- 2.3.1.Thermomechanical Constraints in Die Attach -- 2.3.2.Thermomechanical Constraints in Package-Level Encapsulation -- 2.3.3.Thermomechanical Constraints in Wafer-Level Encapsulation -- 2.3.4.Thermomechanical Constraints in Flip-Chip Bonding -- 2.4.Moisture and Gas Absorption -- 2.4.1.Moisture Absorption -- 2.4.2.Barrier Coatings: A Protection Against Moisture Absorption -- 2.4.3.Outgassing -- 2.5.Conclusions: Reliability Demonstration and Accelerated Testing -- References -- 3.Packaging Requirements for Hermeticity -- 3.1.The Need for Hermeticity in MEMS and Microelectronics Packaging -- 3.2.Balancing Maximum Permissive Leak Rate and Packaging Costs: The Quasi-Hermetic Package -- References -- 4.The Different Types of Leaks in MEMS and Microelectronics Packaging -- 4.1.Introduction -- 4.2.Leak Channels or Capillary Leaks -- 4.3.Permeation -- 4.4.Outgassing -- 4.5.Conclusion -- References -- pt. 2 Traditional Hermeticity Test Techniques and Standards -- 5.Ex Situ Hermeticity Test Methods -- 5.1.Introduction -- 5.2.Fine Leak Tests -- 5.2.1.Helium Fine Leak Test -- 5.2.2.Radioisotope Leak Detection Method -- 5.3.Gross Leak Tests -- 5.3.1.Fluorocarbon Liquid and Vapor Gross Leak Detection -- 5.3.2.Gross Bubble Test -- 5.3.3.Weight Gain -- 5.3.4.Dye Penetrant Gross Leak Test -- 5.4.Combinational Tests -- 5.4.1.Optical Fine/Gross Leak Detection Method -- 5.4.2.Cumulative Helium Leak Detection (CHLD) Method -- References -- 6.The History of Hermeticity Standards MIL-STD-883 T.M. 1014 and MIL-STD-750 T.M. 1071 -- 6.1.Introduction: The First Hermeticity Tests -- 6.2.The Introduction of the Military Standards -- 6.3.The First Problems with Traditional Hermeticity Tests and Standards -- 6.4.Military Standard Revisions -- 6.5.Summary -- References -- pt. 3 Limitations of Existing Hermeticity Test Methods in Low Volume Packages -- 7.Permeation -- 7.1.Introduction -- 7.2.Mathematics of Permeation -- 7.3.Limitations of the Packaging Material -- 7.4.Conclusions -- References -- 8.Outgassing and Residual Gas Analysis (RGA) -- 8.1.Outgassing -- 8.2.Residual Gas Analysis -- References -- 9.Low-Cavity Volume Capillary Leak Limitations -- 9.1.Limitations of the Helium Fine Leak Test Method -- 9.1.1.Volume Limitations -- 9.1.2.Minimum Detectable Leak Rate -- References -- pt. 4 Novel Methods of Leak Detection -- 10.Q-Factor Monitoring of Resonant Microstructures as a Hermeticity Measurement Method -- 10.1.Introduction -- 10.2.Lumped Element Modeling of a Microresonator -- 10.3.Definitions and Measurement Methods of the Quality Factor Q -- 10.3.1.Definition in Terms of Stored Energy -- 10.3.2.Definition in Terms of Bandwidth -- 10.3.3.Determination of the Q-Factor by Amplitude-Frequency Measurement -- 10.3.4.Determination of the Q-Factor by Phase Measurement -- 10.4.Relation Between Pressure and Q-Factor -- References -- 11.In Situ Test Methods in Development -- 11.1.Introduction -- 11.2.Copper Test Structures -- 11.3.Micro-Pirani Gauge -- References -- 12.Ex Situ Hermeticity Test Methods in Development -- 12.1.Introduction -- 12.2.FTIR Spectroscopy -- 12.2.1.Application to Hermeticity -- 12.2.2.Theoretical Limitations -- 12.2.3.Practical Considerations -- 12.2.4.Summary -- 12.3.Raman Spectroscopy -- 12.3.1.Application to the Hermeticity Test -- 12.3.2.Theoretical Limitations -- 12.3.3.Practical Considerations -- 12.3.4.Summary -- References -- pt. 5 Conclusions and Vision -- 13.Summary of Hermeticity Test Methods -- 14.The Way Forward -- 14.1.Introduction -- 14.2.Improvement on Existing Techniques -- 14.3.New Hermetic Materials and Hermeticity Test Methods -- 14.4.Conclusions -- References. |
| 588 ## - SOURCE OF DESCRIPTION NOTE | |
| Source of description note | Description based on print version record. |
| 590 ## - LOCAL NOTE (RLIN) | |
| Local note | Electronic reproduction. Palo Alto, Calif. : ebrary, 2015. Available via World Wide Web. Access may be limited to ebrary affiliated libraries. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Microelectromechanical systems. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Microelectronics. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Microelectromechanical systems |
| General subdivision | Testing. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Microelectronics |
| General subdivision | Testing. |
| 655 #0 - INDEX TERM--GENRE/FORM | |
| Genre/form data or focus term | Electronic books. |
| 700 1# - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Desmulliez, Marc P. Y., |
| Dates associated with a name | 1963- |
| Relator term | author. |
| 797 2# - LOCAL ADDED ENTRY--CORPORATE NAME (RLIN) | |
| Corporate name or jurisdiction name as entry element | ebrary. |
| 830 #0 - SERIES ADDED ENTRY--UNIFORM TITLE | |
| Uniform title | Artech House integrated microsystems series. |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | <a href="http://site.ebrary.com/lib/daystar/Doc?id=11069355">http://site.ebrary.com/lib/daystar/Doc?id=11069355</a> |
| Public note | An electronic book accessible through the World Wide Web; click to view |
| 908 ## - PUT COMMAND PARAMETER (RLIN) | |
| Put command parameter | 170314 |
| 942 00 - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | Electronic Book |
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