Handbook of wafer bonding [electronic resource] / edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M.V. Taklo.

Contributor(s): Material type: TextTextPublication details: Weinheim, Germany : Wiley-VCH, 2012.Description: xxxi, 395 p. : col. illSubject(s): Genre/Form: LOC classification:
  • TK7871.85 .H36 2012eb
Online resources:
Contents:
pt. 1. Technologies -- pt. 2. Applications.
Tags from this library: No tags from this library for this title. Log in to add tags.
Star ratings
    Average rating: 0.0 (0 votes)
No physical items for this record

Includes bibliographical references and index.

pt. 1. Technologies -- pt. 2. Applications.

Electronic reproduction. Palo Alto, Calif. : ebrary, 2011. Available via World Wide Web. Access may be limited to ebrary affiliated libraries.

There are no comments on this title.

to post a comment.