11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany / edited by Jörg Franke [and three others].

By: Contributor(s): Material type: TextTextSeries: Advanced materials research ; Volume 1038.Publisher: Pfaffikon, Switzerland : TTP, 2014Distributor: Enfield, New Hampshire : Trans Tech Publications Ltd, [date of distribution not identified]Copyright date: ©2014Description: 1 online resource (119 pages) : illustrationsContent type:
  • text
Media type:
  • computer
Carrier type:
  • online resource
ISBN:
  • 9783038266365 (e-book)
Subject(s): Genre/Form: Additional physical formats: Print version:: 11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany.DDC classification:
  • 621.367 23
LOC classification:
  • TK7882.I6 .I584 2014eb
Online resources:
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Includes bibliographical references at the end of each chapters and index.

Description based on online resource; title from PDF title page (ebrary, viewed October 16, 2014).

Electronic reproduction. Palo Alto, Calif. : ebrary, 2014. Available via World Wide Web. Access may be limited to ebrary affiliated libraries.

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