Handbook of wafer bonding - Ramm, Peter; Lu, James Jian-Qiang.; Taklo, Maaike M. V.; ebrary, Inc. (Weinheim, Germany : Wiley-VCH, 2012)
pt. 1. Technologies -- pt. 2. Applications.
Includes bibliographical references and index.
Electronic reproduction.
Keywords: Semiconductors -- Bonding -- Handbooks, manuals, etc; Semiconductor wafers; Microelectromechanical systems -- Design and construction; Electronic books