Emerging food packaging technologies  principles and practice /  [electronic resource] : 
edited by Kit L. Yam and Dong Sun Lee. 
 - Oxford ;  Philadelphia, Pa. :  Woodhead Pub.,  c2012. 
 - xxx, 482 p. :  ill. 
 - Woodhead Publishing series in food science, technology and nutrition,  no. 230  2042-8049 ; .
 - Woodhead Publishing in food science, technology, and nutrition ;  no. 230. .
<br/><br/>Includes bibliographical references and index. 
<br/><br/>pt. 1. Developments in active packaging -- pt. 2. Intelligent packaging and the consumer/packaging interface -- pt. 3. Developments in packaging materials -- pt. 4. Environmentally compatible food packaging. 
<br/><br/><br/>Electronic reproduction. <br/>Palo Alto, Calif. : <br/>ebrary, <br/>2013. <br/>Available via World Wide Web. <br/>Access may be limited to ebrary affiliated libraries. 
<br/><br/><label>ISBN: </label>
<br/><br/><label>LCCN: </label>
<br/><br/><label>Subjects--Topical Terms: </label><br/>Food--Packaging.
<br/><br/><label>Index Terms--Genre/Form: </label><br/>Electronic books.
<br/><br/><label>LC Class. No.: </label>TP374  / .E44 2012eb 
<br/><br/><label>Dewey Class. No.: </label>664.09