TY  - BOOK
AU  - Wu,Andy
TI  - Components, packaging and manufacturing technology II: selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia 
T2  - Applied Mechanics and Materials,
AV  - TK7801 .C667 2014eb
U1  - 621.381 23
PY  - 2014///
CY  - Zurich, Switzerland
PB  - TTP
KW  - Electronic apparatus and appliances
KW  - Congresses
KW  - Electronic packaging
KW  - Microelectronic packaging
KW  - Manufacturing processes
KW  - Electronic books
N1  - Includes bibliographical references and indexes
UR  - http://site.ebrary.com/lib/daystar/Doc?id=10846262
ER  -