Semiconductor packaging  materials interaction and reliability /  [electronic resource] : 
Andrea Chen, Randy Hsiao-Yu Lo. 
 - Boca Raton :  CRC Press,  2011. 
 - xviii, 187 p. :  ill. 
<br/><br/>Includes bibliographical references. 
<br/><br/><label>ISBN: </label>9781439862070 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Semiconductors--Reliability.<br/>Electronic packaging--Reliability.<br/>Materials science.<br/>Electrical engineering.
<br/><br/><label>Index Terms--Genre/Form: </label><br/>Electronic books.
<br/><br/><label>LC Class. No.: </label>TK7871.85  / S4675 2011