TY  - BOOK
AU  - Bailey,Christopher
AU  - Liu,Johan
ED  - ebrary, Inc.
TI  - Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging
T2  - Soldering & surface mount technology
AV  - TK7870.15 .A48 2006eb
PY  - 2006///
CY  - Bradford, England
PB  - Emerald Group Publishing
KW  - Manufacturing processes
KW  - Electronic packaging
KW  - Electronic books
KW  - local
N1  - Electronic reproduction; Palo Alto, Calif.; ebrary; 2009; Available via World Wide Web; Access may be limited to ebrary affiliated libraries
UR  - http://site.ebrary.com/lib/daystar/Doc?id=10132649
ER  -