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	1.	Handbook of wafer bonding [electronic resource] / edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M.V. Taklo. by Ramm, Peter Lu, James Jian-Qiang Taklo, Maaike M. V ebrary, Inc Material type: Text; Format: electronic available online ; Literary form: Not fiction Publication details: Weinheim, Germany : Wiley-VCH, 2012 Online resources: An electronic book accessible through the World Wide Web; click to view Availability: No items available. Save to lists Add to cart (remove)
	2.	Handbook of 3D integration. Volume 3, 3D process technology / edited by Philip Garrou, Mitsumasa Koyanagi, and Peter Ramm ; Richard A. Allen [and sixty others], contributors. by Garrou, Philip [editor.] Koyanagi, Mitsumasa [editor.] Ramm, Peter [editor.] Allen, Ricky [contributor.] Material type: Text; Format: available online ; Literary form: Not fiction Publisher: Weinheim, Germany : Wiley-VCH, 2014Copyright date: ©2014 Online resources: An electronic book accessible through the World Wide Web; click to view Availability: No items available. Save to lists Add to cart (remove)

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