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1.
Cost analysis of electronic systems [electronic resource] / Peter Sandborn. by Series: WSPC series in advanced integration and packaging ; vol. 1
Material type: Text Text; Format: electronic available online remote; Literary form: Not fiction
Publication details: Singapore ; Hackensack, NJ : World Scientific Pub., c2013
Availability: No items available.

2.
Design and modeling for 3D ICs and interposers / Madhavan Swaminathan, Ki Jin Han. by Series: WSPC series in advanced integration and packaging ; v. 2.
Material type: Text Text; Format: available online remote; Literary form: Not fiction
Publisher: Singapore ; Hackensack, New Jersey : World Scientific Publishing Company, [2014]Copyright date: ©2014
Availability: No items available.