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	1.	Materials for high-density electronic packaging and interconnection [electronic resource] : report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council. by National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging ebrary, Inc Material type: Text; Format: electronic available online ; Literary form: Not fiction Publication details: Washington, D.C. : Alexandria, VA : National Academy Press ; Available from Defense Technical Information Center, Cameron Station, 1990 Online resources: An electronic book accessible through the World Wide Web; click to view Availability: No items available. Save to lists Add to cart (remove)
	2.	Boundary-scan interconnect diagnosis [electronic resource] / José T. de Sousa, Peter Y.K. Cheung. by Sousa, José T. de Cheung, Peter Y. K ebrary, Inc Series: Frontiers in electronic testing ; 18. Material type: Text; Format: electronic available online ; Literary form: Not fiction Publication details: Boston : Kluwer Academic Publishers, c2001 Online resources: An electronic book accessible through the World Wide Web; click to view Availability: No items available. Save to lists Add to cart (remove)
	3.	Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [electronic resource] / guest editors Christopher Bailey and Johan Liu. by Bailey, Christopher Liu, Johan ebrary, Inc Series: Soldering & surface mount technology ; v.18, no. 2 Material type: Text; Format: electronic available online ; Literary form: Not fiction Publication details: Bradford, England : Emerald Group Publishing, c2006 Online resources: An electronic book accessible through the World Wide Web; click to view Availability: No items available. Save to lists Add to cart (remove)
	4.	LED packaging for lighting applications [electronic resource] : design, manufacturing, and testing / Sheng Liu, Xiaobing Luo. by Liu, S. (Sheng), 1963- Luo, Xiaobing, 1974- Chemical Industry Press ebrary, Inc Material type: Text; Format: electronic available online ; Literary form: Not fiction Publication details: Hoboken, N.J. : Wiley, 2011 Online resources: An electronic book accessible through the World Wide Web; click to view Availability: No items available. Save to lists Add to cart (remove)
	5.	Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia / edited by Andy Wu. by Wu, Andy [editor.] Series: Applied mechanics and materials ; Volume 509. Material type: Text; Format: available online ; Literary form: Not fiction Publisher: Zurich, Switzerland : TTP, 2014Copyright date: ©2014 Online resources: An electronic book accessible through the World Wide Web; click to view Availability: No items available. Save to lists Add to cart (remove)
	6.	Semiconductor packaging [electronic resource] : materials interaction and reliability / Andrea Chen, Randy Hsiao-Yu Lo. by Chen, Andrea Lo, Randy ProQuest (Firm) Material type: Text; Format: available online ; Literary form: Not fiction Publication details: Boca Raton : CRC Press, 2011 Online resources: Click to View Availability: No items available. Save to lists Add to cart (remove)