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	1.	Lead-free solder interconnect reliability [electronic resource] / edited by Dongkai Shangguan. by Shangguan, Dongkai, 1963- ebrary, Inc Material type: Text; Format: electronic available online ; Literary form: Not fiction Publication details: Materials Park, OH : ASM International, 2005 Online resources: An electronic book accessible through the World Wide Web; click to view Availability: No items available. Save to lists Add to cart (remove)
	2.	Portable consumer electronics [electronic resource] : packaging, materials, and reliability / Sridhar Canumalla, Puligandla Viswanadham. by Canumalla, Sridhar Viswanadham, Puligandla ebrary, Inc Material type: Text; Format: electronic available online ; Literary form: Not fiction Publication details: Tulsa, Okla. : PennWell, c2010 Online resources: An electronic book accessible through the World Wide Web; click to view Availability: No items available. Save to lists Add to cart (remove)
	3.	Modeling and simulation for microelectronic packaging assembly [electronic resource] : manufacturing, reliability and testing / Sheng Liu, Yong Liu. by Liu, S. (Sheng), 1963- Liu, Yong, 1962- ebrary, Inc Material type: Text; Format: electronic available online ; Literary form: Not fiction Publication details: Hoboken, N.J. : Wiley, 2011 Online resources: An electronic book accessible through the World Wide Web; click to view Availability: No items available. Save to lists Add to cart (remove)
	4.	Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia / edited by Andy Wu. by Wu, Andy [editor.] Series: Applied mechanics and materials ; Volume 509. Material type: Text; Format: available online ; Literary form: Not fiction Publisher: Zurich, Switzerland : TTP, 2014Copyright date: ©2014 Online resources: An electronic book accessible through the World Wide Web; click to view Availability: No items available. Save to lists Add to cart (remove)
	5.	Adhesion in microelectronics / edited by K. L. Mittal and Tanweer Ahsan. by Mittal, K. L, 1945- [editor.] Ahsan, Tanweer [editor.] Series: Adhesion and adhesives. Fundamental and applied aspects. Material type: Text; Format: available online ; Literary form: Not fiction Publisher: Hoboken, New Jersey ; Salem, Massachusetts : Scrivener Publishing : Wiley, 2014Copyright date: ©2014 Online resources: An electronic book accessible through the World Wide Web; click to view Availability: No items available. Save to lists Add to cart (remove)
	6.	Microwave and millimeter-wave electronic packaging / Rick Sturdivant. by Sturdivant, Rick [author.] Series: Artech House microwave library Material type: Text; Format: available online ; Literary form: Not fiction Publisher: Boston, [Massachusetts] ; London, [England] : Artech House, 2014Copyright date: ©2014 Online resources: An electronic book accessible through the World Wide Web; click to view Availability: No items available. Save to lists Add to cart (remove)
	7.	LCP for microwave packages and modules [electronic resource] / [edited by] Anh-Vu H. Pham, Morgan J. Chen, Kunia Aihara. by Pham, Anh-Vu H Chen, Morgan J Aihara, Kunia ebrary, Inc Series: Cambridge RF and microwave engineering series Material type: Text; Format: electronic available online ; Literary form: Not fiction Publication details: Cambridge ; New York : Cambridge University Press, 2012 Other title: Liquid crystal polymer for microwave packages and modules Online resources: An electronic book accessible through the World Wide Web; click to view Availability: No items available. Save to lists Add to cart (remove)