000 01543nam a22003854a 4500
001 0000119181
005 20171002060335.0
006 m u
007 cr cn|||||||||
008 100312s2009 ne a sb 000 0 eng
010 _z 2010290874
020 _z9781607500261
020 _z1607500264
035 _a(CaPaEBR)ebr10375724
035 _a(OCoLC)591163310
040 _aCaPaEBR
_cCaPaEBR
050 1 4 _aTH2235
_b.F882 2009eb
245 0 4 _aThe future envelope 2
_h[electronic resource] :
_barchitecture, climate, skin /
_cedited by Ulrich Knaack & Tillmann Klein.
246 3 _aFuture envelope two
260 _aAmsterdam :
_bIOS Press,
_cc2009.
300 _avii, 142 p. :
_bill.
490 1 _aResearch in architectural engineering series,
_x1873-6033 ;
_vv. 9
500 _aBased on the contributions to The Future Envelope symposium held June 5, 2008 in Delft.
504 _aIncludes bibliographical references.
533 _aElectronic reproduction.
_bPalo Alto, Calif. :
_cebrary,
_d2013.
_nAvailable via World Wide Web.
_nAccess may be limited to ebrary affiliated libraries.
650 0 _aFacades
_xDesign and construction.
650 0 _aArchitecture and climate.
655 7 _aElectronic books.
_2local
700 1 _aKnaack, Ulrich.
700 1 _aKlein, Tillmann.
710 2 _aebrary, Inc.
830 0 _aResearch in architectural engineering series ;
_vv. 9.
856 4 0 _uhttp://site.ebrary.com/lib/daystar/Doc?id=10375724
_zAn electronic book accessible through the World Wide Web; click to view
908 _a170314
942 0 0 _cEB
999 _c108330
_d108330