000			02108nam a2200493 i 4500
001			0000183384
005			20171002064822.0
006			m o d
007			cr cn|||||||||
008			140506t20142014gw a ob 001 0 eng d
020			_z9783527334667
020			_a9783527670130 (e-book)
020			_a9783527670123 (e-book)
020			_a9783527670116 (e-book)
020			_a9783527670109 (e-book)
035			_a(CaPaEBR)ebr10865387
035			_a(OCoLC)878919955
040			_aCaPaEBR _beng _erda _epn _cCaPaEBR
050	1	4	_aTK7874 _b.H363 2014eb
082	0	4	_a621.3815 _223
245	0	0	_aHandbook of 3D integration. _nVolume 3, _p3D process technology / _cedited by Philip Garrou, Mitsumasa Koyanagi, and Peter Ramm ; Richard A. Allen [and sixty others], contributors.
264		1	_aWeinheim, Germany : _bWiley-VCH, _c2014.
264		4	_c©2014
300			_a1 online resource (475 pages) : _billustrations (some color)
336			_atext _2rdacontent
337			_acomputer _2rdamedia
338			_aonline resource _2rdacarrier
504			_aIncludes bibliographical references at the end of each chapters and index.
588			_aDescription based on online resource; title from PDF title page (ebrary, viewed May 5, 2014).
590			_aElectronic reproduction. Palo Alto, Calif. : ebrary, 2015. Available via World Wide Web. Access may be limited to ebrary affiliated libraries.
650		0	_aIntegrated circuits.
650		0	_aIntegrated circuits _xDesign and construction.
650		0	_aSilicon.
650		0	_aThree-dimensional imaging.
655		0	_aElectronic books.
700	1		_aGarrou, Philip, _eeditor.
700	1		_aKoyanagi, Mitsumasa, _eeditor.
700	1		_aRamm, Peter, _eeditor.
700	1		_aAllen, Ricky, _econtributor.
776	0	8	_iPrint version: _tHandbook of 3D integration. Volume 3, 3D process technology. _dWeinheim, Germany : Wiley-VCH, c2014 _hxxii, 451 pages _z9783527334667
797	2		_aebrary.
856	4	0	_uhttp://site.ebrary.com/lib/daystar/Doc?id=10865387 _zAn electronic book accessible through the World Wide Web; click to view
908			_a170314
942	0	0	_cEB
999			_c172519 _d172519