000 | 01277nam a2200313Ia 4500 | ||
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001 | 0000084894 | ||
005 | 20171002054258.0 | ||
006 | m u | ||
007 | cr cn||||||||| | ||
008 | 000815s2006 enk s 000 0 eng d | ||
020 | _z184663010X | ||
035 | _a(CaPaEBR)ebr10132649 | ||
035 | _a(OCoLC)133162498 | ||
040 |
_aCaPaEBR _cCaPaEBR |
||
050 | 1 | 4 |
_aTK7870.15 _b.A48 2006eb |
245 | 0 | 0 |
_aAdvanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging _h[electronic resource] / _cguest editors Christopher Bailey and Johan Liu. |
260 |
_aBradford, England : _bEmerald Group Publishing, _cc2006. |
||
300 | _a72 p. | ||
490 | 0 |
_aSoldering & surface mount technology ; _vv.18, no. 2 |
|
533 |
_aElectronic reproduction. _bPalo Alto, Calif. : _cebrary, _d2009. _nAvailable via World Wide Web. _nAccess may be limited to ebrary affiliated libraries. |
||
650 | 0 | _aManufacturing processes. | |
650 | 0 | _aElectronic packaging. | |
655 | 7 |
_aElectronic books. _2local |
|
700 | 1 | _aBailey, Christopher. | |
700 | 1 | _aLiu, Johan. | |
710 | 2 | _aebrary, Inc. | |
856 | 4 | 0 |
_uhttp://site.ebrary.com/lib/daystar/Doc?id=10132649 _zAn electronic book accessible through the World Wide Web; click to view |
908 | _a170314 | ||
942 | 0 | 0 | _cEB |
999 |
_c74051 _d74051 |